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Wraparound Chip Resistors w/
Isolated Center Pad
RY Series
Isolated Center Pad
RY Series
Barry Industries manufacturers wraparound chip resistors with center pad on Alumina, AlN and BeO for solder or epoxy. These chip resistors are available in sizes 0805 to 3725 with standard resistance of 0.1Ω to 1GΩ and resistor tolerance to ±1%. Other values are available.
|
Part Number/
Data Sheet |
Size
|
Config.
|
Thickness
|
Substrate
|
Metallization
|
CW Power
(Max) (W) |
RoHS
|
|---|---|---|---|---|---|---|---|
| RY0805CT-XXXXJN-2S | 0805 | Wraparound w/ Isolated Center Pad |
0.025" | AlN | Matte Tin over Ni over Ag | 5 | Yes |
| RY0805CB-XXXXJN-2S | 0805 | Wraparound w/ Isolated Center Pad |
0.025" | AlN | SnPb over Ni over Ag | 5 | No |
| RY0805CT-XXXXJN-98 | 0805 | Wraparound w/ Isolated Center Pad |
0.025" | BeO | Matte Tin over Ni over Ag | 5 | Yes |
| RY0805CB-XXXXJN-98 | 0805 | Wraparound w/ Isolated Center Pad |
0.025" | BeO | SnPb over Ni over Ag | 5 | No |
| RY1005CT-XXXXJN-2S | 1005 | Wraparound w/ Isolated Center Pad |
0.025" | AlN | Matte Tin over Ni over Ag | 8 | Yes |
| RY1005CB-XXXXJN-2S | 1005 | Wraparound w/ Isolated Center Pad |
0.025" | AlN | SnPb over Ni over Ag | 8 | No |
| RY1005CT-XXXXJN-98 | 1005 | Wraparound w/ Isolated Center Pad |
0.025" | BeO | Matte Tin over Ni over Ag | 8 | Yes |
| RY1005CB-XXXXJN-98 | 1005 | Wraparound w/ Isolated Center Pad |
0.025" | BeO | SnPb over Ni over Ag | 8 | No |
| RYC1206CT-XXXXJN-2S | 1206 | Castellated Wraparound w/ Isolated Center Pad |
0.025" | AlN | Matte Tin over Ni over Ag | 10 | Yes |
| RYC1206CB-XXXXJN-2S | 1206 | Castellated Wraparound w/ Isolated Center Pad |
0.025" | AlN | SnPb over Ni over Ag | 10 | No |
| RYC1206CT-XXXXJN-98 | 1206 | Castellated Wraparound w/ Isolated Center Pad |
0.025" | BeO | Matte Tin over Ni over Ag | 12 | Yes |
| RYC1206CB-XXXXJN-98 | 1206 | Castellated Wraparound w/ Isolated Center Pad |
0.025" | BeO | SnPb over Ni over Ag | 12 | No |
| RYC2010CT-XXXXJN-2T | 2010 | Castellated Wraparound w/ Isolated Center Pad |
0.040" | AlN | Matte Tin over Ni over Ag | 20 | Yes |
| RYC2010CB-XXXXJN-2T | 2010 | Castellated Wraparound w/ Isolated Center Pad |
0.040" | AlN | Matte Tin over Ni over Ag | 20 | No |
| RYC2010CT-XXXXJN-98 | 2010 | Castellated Wraparound w/ Isolated Center Pad |
0.025" | BeO | Matte Tin over Ni over Ag | 20 | Yes |
| RYC2010CB-XXXXJN-98 | 2010 | Castellated Wraparound w/ Isolated Center Pad |
0.025" | BeO | SnPb over Ni over Ag | 20 | No |
| RYC2010CT-XXXXJN-98 | 2010 | Castellated Wraparound w/ Isolated Center Pad |
0.040" | BeO | Matte Tin over Ni over Ag | 20 | Yes |
| RYC2010CB-XXXXJN-99 | 2010 | Castellated Wraparound w/ Isolated Center Pad |
0.040" | BeO | SnPb over Ni over Ag | 20 | No |
| RYC2525CT-XXXXJN-2T | 2525 | Castellated Wraparound w/ Isolated Center Pad |
0.040" | AlN | Matte Tin over Ni over Ag | 40 | Yes |
| RYC2525CB-XXXXJN-2T | 2525 | Castellated Wraparound w/ Isolated Center Pad |
0.040" | AlN | SnPb over Ni over Ag | 40 | No |
| RYC3725CT-XXXXJN-2T | 3725 | Castellated Wraparound w/ Isolated Center Pad |
0.040" | AlN | Matte Tin over Ni over Ag | 60 | Yes |
| RYC3725CB-XXXXJN-2T | 3725 | Castellated Wraparound w/ Isolated Center Pad |
0.040" | AlN | SnPb over Ni over Ag | 60 | No |
RY Series Chip Resistor Configuration
Click on link for available Data Sheet. For more options, please contact us with your requirement.
(Click on column header to sort)
(Click on column header to sort)
Ordering Information
Below are Barry Industries' standard wraparound chip resistors with center pad. Engineers are welcome to contact us and we will design a custom wraparound chip resistors with center pad to your exact specifications.
AlN Note: 10Ω to 1KΩ ohm available. Special ohmic value requests welcome.
AlN Note: 10Ω to 1KΩ ohm available. Special ohmic value requests welcome.
Other Available Configurations
Full wrap on either side of chip for solder or epoxy surface mount attachment. Electrically isolated metallized center pad provides contact to heat sink.
RYC Series Chip Resistor Configuration
Castellated connections on either side of chip for solder or epoxy surface mount attachment. Electrically isolated metallized center pad provides contact to heat sink. .
